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1. general description the 74ahc126; 74ahct126 is a high-speed si-gate cmos device and is pin compatible with low-power schottky ttl (lsttl). it is speci?ed in compliance with jedec standard no. 7-a. the 74ahc126; 74ahct126 provides four non-inverting buffer/line drivers with 3-state outputs. the 3-state outputs (ny) are controlled by the output enable input (noe). a low-level at pin noe causes the outputs to assume a high-impedance off-state. the 74ahc126; 74ahct126 is identical to the 74ahc125; 74ahct125 but has active high output enable inputs. 2. features n balanced propagation delays n all inputs have schmitt-trigger action n inputs accept voltages higher than v cc n input levels: u for 74ahc126: cmos level u for 74ahct126: ttl level n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v u cdm jesd22-c101c exceeds 1000 v n multiple package options n speci?ed from - 40 c to +85 c and from - 40 c to +125 c 74ahc126; 74ahct126 quad buffer/line driver; 3-state rev. 04 12 august 2009 product data sheet
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 2 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74ahc126d - 40 c to +125 c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74ahct126d 74ahc126pw - 40 c to +125 c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 74ahct126pw 74ahc126bq - 40 c to +125 c dhvqfn14 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 14 terminals; body 2.5 3 0.85 mm sot762-1 74AHCT126BQ fig 1. functional diagram mna235 1a 1y 2 1 3 1oe 2a 2y 5 4 6 2oe 3a 3y 9 10 8 3oe 4a 4y 12 13 11 4oe fig 2. logic symbol fig 3. iec logic symbol mna234 noe na ny mna236 1 en1 1 3 2 4 6 5 10 8 9 13 11 12
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 3 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as a supply pin or input. fig 4. pin con?guration so14 and tssop14 fig 5. pin con?guration dhvqfn14 74ahc126 74ahct126 1oe v cc 1a 4oe 1y 4a 2oe 4y 2a 3oe 2y 3a gnd 3y 001aac982 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aak180 74ahc126 74ahct126 transparent top view 2y 3a 2a 3oe 2oe 4y 1y 4a 1a 4oe gnd 3y 1oe v cc 6 9 5 10 4 11 3 12 2 13 7 8 1 14 terminal 1 index area gnd (1) table 2. pin description symbol pin description 1oe 1 output enable input 1 (active high) 1a 2 data input 1 1y 3 data output 1 2oe 4 output enable input 2 (active high) 2a 5 data input 2 2y 6 data output 2 gnd 7 ground (0 v) 3y 8 data output 3 3a 9 data input 3 3oe 10 output enable input 3 (active high) 4y 11 data output 4 4a 12 data input 4 4oe 13 output enable input 4 (active high) v cc 14 supply voltage
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 4 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 6. functional description [1] h = high voltage state; l = low voltage state; x = dont care; z = high-impedance off-state. 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for so14 packages: above 70 c the value of p tot derates linearly at 8 mw/k. for tssop14 packages: above 60 c the value of p tot derates linearly at 5.5 mw/k. for dhvqfn14 packages: above 60 c the value of p tot derates linearly at 4.5 mw/k. table 3. function table [1] control input output noe na ny hl l hhh lxz table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v v i input voltage - 0.5 +7.0 v i ik input clamping current v i < - 0.5 v [1] - 20 - ma i ok output clamping current v o < - 0.5 v or v o > v cc + 0.5 v [1] - 20 +20 ma i o output current v o = - 0.5 v to (v cc + 0.5 v) - 25 +25 ma i cc supply current - +75 ma i gnd ground current - 75 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [2] - 500 mw
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 5 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 8. recommended operating conditions 9. static characteristics table 5. operating conditions symbol parameter conditions min typ max unit 74ahc126 v cc supply voltage 2.0 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 3.0 v to 3.6 v - - 100 ns/v v cc = 4.5 v to 5.5 v - - 20 ns/v 74ahct126 v cc supply voltage 4.5 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 4.5 v to 5.5 v - - 20 ns/v table 6. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max 74ahc126 v ih high-level input voltage v cc = 2.0 v 1.5 - - 1.5 - 1.5 - v v cc = 3.0 v 2.1 - - 2.1 - 2.1 - v v cc = 5.5 v 3.85 - - 3.85 - 3.85 - v v il low-level input voltage v cc = 2.0 v - - 0.5 - 0.5 - 0.5 v v cc = 3.0 v - - 0.9 - 0.9 - 0.9 v v cc = 5.5 v - - 1.65 - 1.65 - 1.65 v v oh high-level output voltage v i = v ih or v il i o = - 50 m a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = - 50 m a; v cc = 3.0 v 2.9 3.0 - 2.9 - 2.9 - v i o = - 50 m a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = - 4.0 ma; v cc = 3.0 v 2.58 - - 2.48 - 2.40 - v i o = - 8.0 ma; v cc = 4.5 v 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il i o = 50 m a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 m a; v cc = 3.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 m a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 3.0 v - - 0.36 - 0.44 - 0.55 v i o = 8.0 ma; v cc = 4.5 v - - 0.36 - 0.44 - 0.55 v
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 6 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state i i input leakage current v i = 5.5 v or gnd; v cc =0vto5.5v - - 0.1 - 1.0 - 2.0 m a i oz off-state output current v i = v ih or v il ; v o =v cc or gnd; v cc = 5.5 v -- 0.25 - 2.5 - 10.0 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - - 2.0 - 20 - 40 m a c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf 74ahct126 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 - - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - - 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = - 50 m a 4.4 4.5 - 4.4 - 4.4 - v i o = - 8.0 ma 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 50 m a - 0 0.1 - 0.1 - 0.1 v i o = 8.0 ma - - 0.36 - 0.44 - 0.55 v i i input leakage current v i = 5.5 v or gnd; v cc =0vto5.5v - - 0.1 - 1.0 - 2.0 m a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd per input pin; other inputs at v cc or gnd; i o = 0 a; v cc = 5.5 v -- 0.25 - 2.5 - 10.0 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - - 2.0 - 20 - 40 m a d i cc additional supply current per input pin; v i =v cc - 2.1 v; other pins at v cc or gnd; i o =0a; v cc = 4.5 v to 5.5 v - - 1.35 - 1.5 - 1.5 ma c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf table 6. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 7 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 10. dynamic characteristics table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 8 . symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max min max 74ahc126 t pd propagation delay na to ny; see figure 6 [2] v cc = 3.0 v to 3.6 v c l = 15 pf - 4.7 8.0 1.0 9.5 1.0 10.0 ns c l = 50 pf - 6.7 11.5 1.0 13.0 1.0 14.5 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 3.3 5.5 1.0 6.5 1.0 7.0 ns c l = 50 pf - 4.7 7.5 1.0 8.5 1.0 9.5 ns t en enable time noe to ny; see figure 7 [3] v cc = 3.0 v to 3.6 v c l = 15 pf - 5.3 8.0 1.0 9.5 1.0 10.0 ns c l = 50 pf - 7.6 11.5 1.0 13.0 1.0 14.5 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 3.6 5.3 1.0 6.1 1.0 7.0 ns c l = 50 pf - 5.1 7.6 1.0 8.7 1.0 9.5 ns t dis disable time noe to ny; see figure 7 [4] v cc = 3.0 v to 3.6 v c l = 15 pf - 6.6 9.7 1.0 11.5 1.0 12.5 ns c l = 50 pf - 9.4 13.2 1.0 15.0 1.0 16.5 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 4.7 6.8 1.0 8.0 1.0 8.5 ns c l = 50 pf - 6.7 8.8 1.0 10.0 1.0 11.0 ns c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [5] -10- - - - -pf 74ahct126; v cc = 4.5 v to 5.5 v t pd propagation delay na to ny; see figure 6 [2] c l = 15 pf - 3.0 5.5 1.0 6.5 1.0 7.0 ns c l = 50 pf - 4.3 7.5 1.0 8.5 1.0 9.5 ns t en enable time noe to ny; see figure 7 [3] c l = 15 pf - 3.3 5.1 1.0 6.0 1.0 6.5 ns c l = 50 pf - 4.7 7.1 1.0 8.0 1.0 9.0 ns t dis disable time noe to ny; see figure 7 [4] c l = 15 pf - 4.8 6.8 1.0 8.0 1.0 8.5 ns c l = 50 pf - 6.9 8.9 1.0 10.0 1.0 11.5 ns c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [5] -12- - - - -pf
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 8 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state [1] typical values are measured at nominal supply voltage (v cc = 3.3 v and v cc = 5.0 v). [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzl and t pzh . [4] t dis is the same as t plz and t phz . [5] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; s (c l v cc 2 f o ) = sum of the outputs. 11. waveforms measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. input to output propagation delays mna237 t phl t plh v m v m na input ny output gnd v i v oh v ol measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 7. enable and disable times mna949 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 9 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state table 8. measurement points type input output v m v m v x v y 74ahc126 0.5 v cc 0.5 v cc v ol + 0.3 v v oh - 0.3 v 74ahct126 1.5 v 0.5 v cc v ol + 0.3 v v oh - 0.3 v test data is given in t ab le 9 . de?nitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. r l = load resistance. s1 = test selection switch. fig 8. test circuitry for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aad983 dut v cc v cc v i v o r t r l s1 c l open g table 9. test data type input load s1 position v i t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz 74ahc126 v cc 3.0 ns 15 pf, 50 pf 1 k w open gnd v cc 74ahct126 3.0 v 3.0 ns 15 pf, 50 pf 1 k w open gnd v cc
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 10 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 12. package outline fig 9. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 11 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state fig 10. package outline sot402-1 (tssop14) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 a max. 1.1 pin 1 index
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 12 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state fig 11. package outline sot762-1 (dhvqfn14) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.65 1.35 y 1 2.6 2.4 1.15 0.85 e 1 2 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot762-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot762-1 dhvqfn14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 26 13 9 8 7 1 14 x d e c b a 02-10-17 03-01-27 terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 13 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 13. abbreviations 14. revision history table 10. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model lsttl low-power schottky transistor-transistor logic mm machine model table 11. revision history document id release date data sheet status change notice supersedes 74ahc_ahct126_4 20090812 product data sheet - 74ahc_ahct126_3 modi?cations: ? added type numbers 74ahc126bq and 74AHCT126BQ (dhvqfn14 package) 74ahc_ahct126_3 20080425 product data sheet - 74ahc_ahct126_2 74ahc_ahct126_2 19990929 product speci?cation - 74ahc_ahct126_n_1 74ahc_ahct126_n_1 19990112 preliminary speci?cation - -
74ahc_ahct126_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 12 august 2009 14 of 15 nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74ahc126; 74ahct126 quad buffer/line driver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 12 august 2009 document identifier: 74ahc_ahct126_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16 contact information. . . . . . . . . . . . . . . . . . . . . 14 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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